MOSFET 晶圆后端工艺彙整 - iST宜特

2018-08-08by judy

晶粒挑揀 (Tape / Reel)

2018-08-08by judy

切割後測試 (Frame Probing)

2018-08-08by judy

芯片切割 (Die Sawing)

2018-08-08by judy

太鼓環移除 (Ring removal)

2018-08-08by judy

真空貼片 (Vacuum Mounting)

2018-08-08by judy

激光刻号 (Laser Marking)

2018-08-08by judy

芯片探测 (Chip Probing)

2018-08-01by judy

厚银工艺 (Thick Ag Process)

2018-08-01by judy

金属蒸发沉积 (Metal Evaporation for Backside Metallization)

2018-08-01by judy

晶圆减薄(Wafer Thinning/ Non-Taiko Grinding/Conventional Grinding)